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Date: | Tue, 20 Sep 2011 23:24:37 +0300 |
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Just the assembly house is not objective...
נשלח מה-iPhone שלי
ב-Sep 20, 2011, בשעה 11:12 PM, Carl VanWormer <[log in to unmask]> כתב/ה:
> (Resent after editing for better communication:)
>
> There is a mix of opinions, including black pad, un-melted solder,
> Nickel-Tin interface, reflow profile; ENIG is evil, wetting problems and
> brittle fractures (and maybe more).
>
> I just finished checking the 20 boards we have on the shelf, finding 2
> more with the problem. On the bad assemblies, all of the solder pulls
> off the PCB pad, leaving the pad with no Gold. Turning my destructive
> tendencies to (THE GOOD) assemblies; if I pull hard enough on the SMT
> electrolytic cap, the cap leads pull out of the solder blob with the
> expected blob surface tearing.
>
> Our board assembly house has asked for the bad boards so they can
> evaluate the problem. They will probably have the experience to make a
> proper determination of root cause. If they do come to a conclusion,
> I'll let the group know "the rest of the story".
>
> Thanks to all who took time to share opinions and suggestions,
> Carl
>
>
>
>
>
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