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Subject:
IPC-9708, Test Methods for Characterization of Printed Board Assembly Pad Cratering
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Date:
Mon, 21 Oct 2019 15:30:51 +0000
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Fellow TechNetters:

   Reference:    IPC-9708m (2010)      Test Methods for Characterization of Printed Board Assembly Pad Cratering

   Can anyone out there with experience conducting the above Test Method offer suggestion on Pin Grabbers Hardware (Pin Pull Test) and Solder Bump/Sphere fixturing (Ball Pull Test).   We currently have a Mark10 Stand that might assist with the pull force tracking and two gauges Model # M5-10 and BG500.

   You may contact on line or off line if you will.

Victor,

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