For thermal stress, the coupon (appropriately detached as the "B" coupon
from the specified quality conformance test circuitry) is floated once only
for 10 seconds at 550 degrees F. This exceeds most all soldering process
conditions thus rendering it proof of being able to withstand the most
abusive, poorly process managed soldering operations available.

Earl Moon
----- Original Message -----
From: Richard Olsen <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, October 04, 1999 2:10 PM
Subject: [TN] Solder float thermal shocks.


> Hello,
>     When floating coupons (for eventual crossectioning) on solder multiple
times
> (with a cool-down to ambient in between), to see if defects appear, should
the
> sample be turned over for each new float?  Is there a procedure or paper
that
> addresses this question? If anyone is doing this , what is the reason?
> Thanks
> Rich
>
> ------------------------------------------------------------------
>      Richard Olsen                Telephone (602)-824-8599
>      Hadco-Phoenix                Main      (602)-824-8301
>      5020 South 36th Street       Fax       (602)-268-7386
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>      85040-2905                   Internet  [log in to unmask]
>      USA                    I make circuit boards,what do you do?
> ------------------------------------------------------------------
>
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