Is there any news when criteria for BGA joints will be included in the IPC or J Standard. Also are there plans in the near future to
recognise the use of alternative PCB solder finishes and some of the cosmetic issues which are not covered by existing documents.

Is there any work on criteria specifically for pin in hole intrusive reflow as this is becoming and issue with some companies
implementation plans.

Look forward to some feedback on each of these issues.



Bob Willis

Tel: (44) 01245 351502
Fax: (44) 01245 496123
Email: [log in to unmask]
Web Page: www.bobwillis.co.uk
Web Page: www.leadfreesoldering.com
Web Page: www.online4training.com

Europe's leading supplier of training products and training workshops
on electronic assembly and your guarantee of quality training.

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