In a previous life we use a small board very similar to the one you showed
in the picture. Instead of using pins we used a half moon castilation
similar to what you would get on an Leadless chip carrier. We soldered
it to the plated through holes and used some adhesive under it to add that
little extra. As we ordered new boards we updated the artwork to fit the
new parts instead of using a sister board as we called it. This was done
on a very small number of boards (<500) and was used in Cell sites so no
vibration requirements for the parts soldered to the board.
"d. terstegge"
<[log in to unmask] To: [log in to unmask]
SGROUP.COM> cc:
Sent by: TechNet Subject: [TN] Replacing a DIP package
<[log in to unmask]>
11/14/03 09:00 AM
Please respond to
"TechNet E-Mail Forum.";
Please respond to "d.
terstegge"
Hi Technet,
http://www.parallax.com/images/prod_jpg/bs2p24-ic.jpg is a picture of a
tiny pcb assembly that can be wavesoldered onto a motherboard almost
like a normal through-hole package. Due to an obsolescense problem we
are thinking about replacing a 22-pins DIP-package by a construction
similar to what's in the picture.
Does anyone know what technology to use to get the sidepins connected
to the substrate, and does this fit within a normal PCB Assembly
process? Also any ideas about alternative solution are more then
welcome.
Best regards!
Daan Terstegge
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net
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