Dear Engelmaier
    I am sorry for delay to discuss this topic.Would please tell me what kind of preheater should be used?I mean what the preheater looks like, a bake oven,IR burner with a cover or sth else?
    I talked about the PTH component including surface pad,we  use thermal-pad designs.
   The board with ENIG surface finish usually have hand soldering problems.(Please see attacted files).Somebody suggest us use a bigger pad size,is it all right?
    Is there any limitation of connected layers?

Regards
Don
Huawei

----- Original Message -----
From: "Werner Engelmaier" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, June 17, 2003 12:19 AM
Subject: Re: [TN] High heat sink board hand soldering


> Nee how Don,
> 1. I would preheat even higher, 110 to 115C, measured on the board.
> 2. I take it you talk surface pad, are your internal pads thermal-pad designs?
> 3. If you have good Cu plating and no further soldering operations, and no
> severe temperature cycling [in test or operation] 25 to 50% fill should be o.k.
>
> Regards,
> Werner Engelmaier
>
> ---------------------------------------------------
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
> -----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------