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May 1998

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Subject:
From:
Phil Crepeau <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 8 May 1998 07:20:22 U
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hi,

sorry to disagree with you, but we found that very bulbous joints on lcc's were more advantageous than tall standoffs for surviving temperature cycling.

phil crepeau
------------------------------
Date: 5/7/98 10:08 PM
From: TechNet E-Mail Forum.

>Jo,
>Unfortunately, the advice given that larger volume solder joints are more
>robust is bad advice...

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