Fellow AIR-VAC Users,



Good morning.

Occasionally, it is a challenge to heat small high mass boards (with a lot
of copper in the inner layers) sufficiently to achieve an acceptable solder
temperature under a larger BGA and maintain component body temperature
within the manufacturer's limits using an EZ style nozzle.



Would any of you DRS24 users like to share your experiences?



What nozzle styles have you found to work best - EZ, ES, MX, or DVG?  I have
heard pros and cons concerning using nozzle that basically cover the BGA and
stand off a few mm from the board (e.g., the delta T between the BGA and
surrounding area is too high because you do not have enough radial heating).



Has anyone modified their station to include some type of post reflow
cooling like the newer Air-VAC machines offer?



Look forward to your reply. Thanks again

Joe




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