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October 1999

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Subject:
From:
Michael Fenner <[log in to unmask]>
Reply To:
Michael Fenner <[log in to unmask]>
Date:
Tue, 19 Oct 1999 20:31:15 +0100
Content-Type:
text/plain
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text/plain (34 lines)
What is the failure?
Mike

----- Original Message -----
From: Gabriela Bogdan <[log in to unmask]>
To: Michael Fenner <[log in to unmask]>
Sent: 19 October 1999 19:55
Subject: Re: [TN] TIN/GOLD alloy


> Hi, Michael!
> Yes to all the questions, but It is indirectly my problem, as I receive this subassembly
and
> want to check the manufacturer's process.Due to failure after reflow, I want to work out
a
> solution.This alloy is in Indium's product list.
> Thank You Very Much!
> Gaby
>

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