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April 2000

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Subject:
From:
Craig Leppanen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 27 Apr 2000 08:46:36 -0400
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I have a situation on an SMT OSP board.  There is some exposed copper on the
periphery of fine pitch lands.  The lands have greater than 85% solder coverage
and acceptable joints.  But the customer is concerned about the exposed copper.
I have not seen a spec explicitly stating that exposed copper on an OSP board is
acceptable.  Does such a spec exist??

Thanks, Craig Leppanen

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