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October 2002

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Subject:
From:
Richard Carruth <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 29 Oct 2002 14:04:50 -0600
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Peter,

Make sure your PCA is not to deep in the solder wave. Immersion depth should
typically be 50% of PWB thickness with your dwell time around 3 sec. depending
on board type and design. Your contact length should be about 2 inches. We use a
Wave Solder Optimizer to control such parameters.

Best of Luck
Richard Carruth
Quality Eng.
LaBarge Inc.
Ph# 918-459-2346




[log in to unmask] on 10/29/2002 02:02:25 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to
      [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: Richard Carruth/LABARGE)

Subject:  [TN] Raised TH components after Wave



Hi all,

We are experiencing a large number connecters and / or sockets that are
raised after the Wave Solder process.

We classify a raised part as any gap between the PBC and the component even
though we are still keeping with IPC's standard of lead length.  Is our
defect classification overkill?

If not, does anyone have this problem and can suggest a remedy?


Peter Crain
Manufacturing Engineering Technologist

Substation Automation Solutions
General Electric Canada Inc.
2728 Hopewell Place N.E., Calgary, Alberta T1Y 7J7  CANADA

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