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August 2004

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Subject:
From:
"Morse, Carrie" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Morse, Carrie
Date:
Tue, 24 Aug 2004 09:07:29 -0400
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For all you Plating Experts 
We have a customer specifying 500 micro inches minimum of Low Stress
Nickel under 3-5 micro inches of Gold.
 
1.  What is the purpose of the Ni?  Is it to aid in bonding the gold?
2.  Is 500 micro inches too much?  What are board houses capable of
doing without damaging the board and....what would board houses like to
see for a minimum specification on a note?
 
Thanks,
Carrie

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