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July 1997

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Subject:
From:
"Bill Chou" <[log in to unmask]>
Date:
25 Jul 1997 10:53:36 -0800
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                           Subject:                         Time:   10:41 AM
                           GEN:cost analysis and model      Date:   7/25/97

Hi:

I need some help on new project for cost analysis of board fabrication and
assembly.  I will focus on build up technology, multilayer high density flex
fabrication and assembly (BGA, C4,...etc.).  Can anyone recommend or share the
source or vendor for following information:
* book, paper, literature
* cost model
* consultant
* source for data

Thanks


Bill Chou
Fujitsu Computer Packaging Technologies,Inc.
[log in to unmask]
(408)943-7721
fax: (408)943-7790

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