Electroless Nickel with Immersion Gold over it. Typically the nickel is
around 150-180 uinches, with gold thickness held between 5 and 10
uinches. This is changing, I think, to between 3 to 6 uinches of gold.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of jrm
Sent: Wednesday, October 12, 2005 12:23 PM
To: [log in to unmask]
Subject: Re: [TN] wire bonding

What is ENIG?

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ingemar Hernefjord
(KC/EMW)
Sent: Wednesday, October 12, 2005 1:18 AM
To: [log in to unmask]
Subject: Re: [TN] wire bonding

Hi Kathy,
we have been using Al wedgebonding on ENIG for many years, from 37um
wires to 250um.
Works just fine.... if you have a reliable ENIG plater, of course.
Ingemar Hernefjord
Ericsson Microwave Systems

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Kathy
Sent: den 11 oktober 2005 21:42
To: [log in to unmask]
Subject: [TN] wire bonding


Question for the assemblers:

When wirebonding to ENIG, do you use any solder paste or other
"facilitator"

to create the bond?

Thanks for your reply...










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