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January 2018

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Subject:
From:
Jose A Rios <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jose A Rios <[log in to unmask]>
Date:
Mon, 29 Jan 2018 18:26:10 +0000
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With more sophisticated Failure Analysis techniques one can pinpoint the origin of the separation, that is, if the separation originates from residual pseudo-smear on the post, that wasn’t removed during desmear. Sometimes the separation can be attributed to the interface between Eless Cu and the electroplated copper, exonerating the desmear process.





José (Joey) Ríos, Sr QA Engineer

Mission Assurance Manager

Kavli Institute for Astrophysics & Space Research

Massachusetts Institute of Technology

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(617)324-6272









On Jan 29, 2018, at 1:54 PM, [log in to unmask]<mailto:[log in to unmask]> wrote:



Fellow TechNetters:



  Is there a signature associated with IPseparation besides the post separation gap.   Perhaps from the Desmear process, permanganate bath.   Anything........



Victor,




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