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From:
Ioan Tempea <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ioan Tempea <[log in to unmask]>
Date:
Wed, 13 Mar 2024 11:10:21 +0000
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Thanks Doug!

Indiscreet questions:
- How do you make sure your spec is what you get? Do you request dyne testing by the PCB fab?
- Do you measure dynes at Incoming or just in case you have issues on the assembly line?
- Does surface energy variate during assembly? I mean a 40+ dynes/cm at Incoming, will it stay the same after 2 reflows, some TH assembly, rework, staking, etc., even with proper cleaning?

Best regards,

Ioan

-----Message d'origine-----
De : TechNet <[log in to unmask]> De la part de Pauls, Doug Collins
Envoyé : March 12, 2024 10:03 PM
À : [log in to unmask]
Objet : Re: [TN] Surface energy for conformal coating

Ioan,
In general, I have used this rule of thumb:
<30 dynes/cm - you will see problems with adhesion and wetting.
30-35 dynes/cm - you will still see problems with adhesion and wetting, but not as much as under 30.
35-40 dynes/cm - generally decent adhesion and wetting but occasional issues
40+ dynes/cm - good adhesion and wetting.  Collins specifies >44 dynes/cm for its solder mask.

Douglas Pauls | Sr. Technical Fellow | Electronics AMT COLLINS AEROSPACE
400 Collins Road NE, MS 108-101, Cedar Rapids, IA  52498  USA
Tel: +1 319 295 2109 | Mobile: +1 319 431 3773

-----Original Message-----
From: TechNet <[log in to unmask]> On Behalf Of Ioan Tempea
Sent: Monday, March 11, 2024 2:42 PM
To: [log in to unmask]
Subject: [External] [TN] Surface energy for conformal coating

Hello Technos,

Some many years ago I have discovered, with help from this illustrious panel, the existence of the dyne pens. Have used them for a while and them moved to microelectronics, where I have spent 11 years without any contact with conformal coating. So I've kinda forgot some details.
Where I work we have the Surface Analyst device, measuring contact angles and this is supposed to obsolete the use of dyne pens.

The trouble is I can't remember what dyne values are related to good coating wetting. Or even better, which contact angles are preferred?

Can anyone help?
I'm interested in both solder masked PCBs and Au plated ceramics and the optimal values I believe differ from PCB to ceramics.

Also, do you have any good articles or textbooks to recommend on this matter?

Thanks,

Ioan

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