Could with a quick spot of help hear chaps!

Having never used water soluble temporary mask I need some input.

I have a problem with some LCC's that have been converted to 'J' leaded
and require tinning..  Unfortunately with them being 'J' leaded the
sides are castellated/plated and the solder wicks up the body of the
component negating the benefits of 'J' leaded compliance.

I have tried several methods of pre-tinning having the luxury of a GPD
robotic tinning m/c with the benefits of nitrogen but no matter how I
try, flux, no flux, N2 the result is the same these suckers wick up
like=

there's no tomorrow!

What I have in mind is turning the rascals upside down and dipping them
into a w/s temporary mask that will just cover the minimum required
then=

I can tin them & wash them off (they are hermetically sealed).  What I
don't is the viscosity of the stuff and whether if too thick with it
being water soluble it could be diluted to a consistency that would
allow coverage between the leads.

Any info would be just great.

CIA,
      Iain.





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