TECHNET Archives

October 2006

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Kane, Amol (349)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kane, Amol (349)
Date:
Mon, 16 Oct 2006 08:12:18 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (97 lines)
Dear Technetters,
How feasible is: 
1. measuring the component weight as a quick indicator of its floor life for MSL considerations, if the "dry" weight of the component is known?
2. measuring the PCB weight after multiple reflow cycles to determine whether the laminate is approaching the end of its useful life?

is anybody out there actually using these metrics to draw valid conclusions? If so, what scales are being used for the measurements? (least count wise)  

Thanks in advance,
Amol



 -----Original Message-----
From:   TechNet [mailto:[log in to unmask]]  On Behalf Of Paul Reid
Sent:   Monday, October 16, 2006 7:52 AM
To:     [log in to unmask]
Subject:        Re: [TN] T-260 laminate testing

I can't answer your question directly from a specification point of view. I do not know what the standards may be.  From a practicle point of view I would question material with less than a 10-minute time to delamination and even then I would be skeptical.

The problem with T260 is that it has only one thermal cycle.  Some poor performing materials can handle one thermal excursion well but are significantly, adversely affected after 3 thermal excursions, which is what most PWBs are exposed to during assembly.  

Our company has adopted a "cyclic" T260 (cT260) protocol where a material is thermal cycled to 260 6 times, to simulate assembly (3 cycles) and rework (3 cycles), and then held at 260C until delamination.  The cycle we use is a six-step ramp to 260C followed with a 100C/min cool cycle.  The total cycle, ambient to ambient is about 6 minutes.  Samples from known low reliability boards, where, based on microscopic examination, there are no obvious process problems like low copper etc., fail in less then 10 minutes.

What we have found is that some "high performance" materials degrade with thermal cycling to 260C.  A single thermal excursion to 260C is not a very accurate tool for measuring materials reliability.  

Even though this is a delamination test, it is important to know that PWBs fabricated with material that have poor cT260 results usually do not fail for delamination.  The common failure is barrel cracks in the central zone of the PTH.

Paul Reid
613 596 4244 ext. 229

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Wolfgang Erat
Sent: Friday, October 06, 2006 5:22 PM
To: [log in to unmask]
Subject: [TN] T-260 laminate testing


Good day

What are acceptability minimum results for T-260 testing.
The laminate in question is rather basic FR-4 with a Tg of 140
Doing some searching I come up with numbers anywhere between 5 minutes
and 30 minutes. Any insight is appreciated.

Wolfgang
[log in to unmask]




---------------------------------------------------------------------
This transmission (including any attachments) may contain confidential information, privileged material (including material protected by the solicitor-client or other applicable privileges), or constitute non-public information. Any use of this information by anyone other than the intended recipient is prohibited. If you have received this transmission in error, please immediately reply to the sender and delete this information from your system. Use, dissemination, distribution, or reproduction of this transmission by unintended recipients is not authorized and may be unlawful.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------





CONFIDENTIALITY NOTICE: 
This e-mail, and any attachments, is for the sole use of the intended 
recipient(s) and may contain information that is confidential and 
protected from disclosure under the law. Any unauthorized review, use, 
disclosure, or distribution is prohibited. If you are not the intended 
recipient, please contact the sender by reply e-mail, and delete/destroy 
all copies of the original message and attachments. 
Thank you.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2