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Subject:
SV: [TN] Via in pad finished flatness
From:
Ingemar Hernefjord <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ingemar Hernefjord <[log in to unmask]>
Date:
Tue, 25 Oct 2005 22:21:14 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (57 lines) 
Our spec says maximum Ra = 3 micrometers 
Ingemar Hernefjord
Ericsson Microwave Systems

-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För David Greig
Skickat: den 25 oktober 2005 16:02
Till: [log in to unmask]
Ämne: [TN] Via in pad finished flatness

Hi TN,

>From an assembly perspective, what is the maximum surface roughness
tolerable for via in pad 0.5mm pitch BGA, particularly
larger parts with pin counts >=80?

Same topic, but from a fabrication viewpoint:- What is achievable using
either 1 stage plated shut process or a 2 step process
using filled/levelled microvia which is then plated over?

Best Regards

David Greig
______________________________
GigaDyne Ltd
http://www.gigadyne.co.uk <http://www.gigadyne.co.uk/>
<http://www.gigadyne.co.uk/>
______________________________


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