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June 2017

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Subject:
From:
"Gumpert, Ben" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gumpert, Ben
Date:
Tue, 6 Jun 2017 20:53:58 +0000
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Peter,

I don't believe there is anything in IPC-A-610 specific to this, but there are requirements in J-STD-001. See paragraph 4.18.3 "Partially Visible or Hidden Solder Connections"

Ben

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Peter Wong
Sent: Tuesday, June 6, 2017 4:25 PM
To: [log in to unmask]
Subject: EXTERNAL: [TN] Vertical fill

Hi everyone,

We have a conflict between inspectors.  We have a through hole header where the destination side solder joints are partially hidden.
This is an IPC-A-610 Class 2 assembly and we are wondering what are the requirements for vertical fill and wetting on the destination side when you can't see them?

Thanks
Peter
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