Hi Nagaraj,

Have a look at MIL-STD-883 (free download, just google it), Methods 1010 or 1011, section 3.

Regards,

Ioan Tempea

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Nagaraj U
Sent: December-13-15 4:00 AM
To: [log in to unmask]
Subject: [TN] Query on Temperature Cycling testing

Hi All,

We are manufacturers of bare PCBs.

We were conducting temperature cycling test as per Condition B of JESD22-A104D (-55°C to +125°C). The test requirement was for 500 cycles. This testing was a part of qualification of PCBs for one of our customer.

We have loaded a set of 4 bare PCBs and 4 assembled PCBs (not powered on - loaded in passive mode after assembly) in the thermal cycling chamber.

Now, 350 cycles are completed, but the thermal cycling chamber has stopped due to some issue with the thermal cycling equipment.

Now my question......... can the testing be continued for another 150 cycles to complete 500 cycles OR should the whole exercise be started from fabrication of fresh PCBs, Assembly and do the temperature cycling all over again.

OR, is there any standards which I could refer to handle this situation.

Thanks in advance for your valuable inputs.

Best Regards,
U.Nagaraj
MICROPACK LIMITED,
Bangalore, INDIA.
Kindly note: Our domain name has changed to micropack.in from micro-pack.com, please update my email-id in your address book with the new domain name - micropack.in

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