The IPC SMT land bond strength test method was cancelled due to
1) uncertainty of the method
2) ultimate tensile strength doesn't model the actual failure mode risks very well

Note that:
2.4.1 has much lower uncertainty because it provides a circular land, with hole to build ideal attachment geometry.
Ultimate tensile is not useless data, but peel strength (IPC-TM-650 2.4.8) is generally considered a better model of foil adhesion to laminate.

Chris Mahanna
Robisan Laboratory Inc.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Deng RongJun
Sent: Monday, September 28, 2015 6:45 AM
To: [log in to unmask]
Subject: [TN] Land bond strength on rigid board

Hi Experts:

Is there have a standard for SMT Land bond strength test? What about the formula for force calculation?
Can I use “IPC-TM-650 2.4.21 Land Bond Strength, Unsupported Component Hole” for reference?




Best regards

RongJun Deng
Electronics Engineer
Design Link




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