No, but the point was that certain frequencies can harm certain components. It is logical to carry that over to BGA packages, in fact, more so. Thus the need to steer clear of those fixed frequencies.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Thursday, August 04, 2005 10:52 AM
To: [log in to unmask]
Subject: Re: [TN] Question on cleaning boards with BGA.
Heh heh,
Not sure the BGA was around when that paper was written.................8-)
John
------------------------------------
Avanex
John Burke
Senior Manager RoHS Compliance
[log in to unmask]
40919 Encyclopedia Circle
Fremont
CA 94538
tel: 510 897 4250
fax: 510 979 0189
mobile: 510 676 6312
------------------------------------
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Thursday, August 04, 2005 4:44 AM
To: [log in to unmask]; [log in to unmask]
Cc: [log in to unmask]
Subject: RE: [TN] Question on cleaning boards with BGA.
The article is great reading. However, I did not see any component listing
for Ball Grid Array. Does this mean that USC can harm this type of
interconnection.
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Wednesday, August 03, 2005 1:23 PM
To: [log in to unmask]
Subject: Re: [TN] Question on cleaning boards with BGA.
You can download the complete paper fro here:
http://www.aqueoustech.com/images/KB/Ultrasonic%20Cleaning%20of%20Military%2
0PWAs.pdf
John
------------------------------------
Avanex
John Burke
Senior Manager RoHS Compliance
[log in to unmask]
40919 Encyclopedia Circle
Fremont
CA 94538
tel: 510 897 4250
fax: 510 979 0189
mobile: 510 676 6312
------------------------------------
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Stadem, Richard
Sent: Wednesday, August 03, 2005 11:17 AM
To: [log in to unmask]
Subject: Re: [TN] Question on cleaning boards with BGA.
Found it! http://www.empf.org/library/abstracts/ts0040.html
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Tremmel
Sent: Wednesday, August 03, 2005 9:22 AM
To: [log in to unmask]
Subject: Re: [TN] Question on cleaning boards with BGA.
Hello,
Could you share the URL for the ACI article on US cleaning?
David Tremmel
Technical Manager
Belmont Trading Mexico
Cell - (847) 858-5540
>From: "Stadem, Richard" <[log in to unmask]>
>Reply-To: TechNet E-Mail Forum <[log in to unmask]>, "Stadem,
>Richard" <[log in to unmask]>
>To: [log in to unmask]
>Subject: Re: [TN] Question on cleaning boards with BGA.
>Date: Wed, 3 Aug 2005 09:06:49 -0500
>
>Ramon,
>It is of a different frequency. When I first purchased it, I bought it
>from Crest Ultrasonics in North Dakota. The tech rep was very
>knowledgeable. He told me that it operated at a different frequency
>from the Branson units, and it would not harm (or be less likely to
>harm) the components. I do not recall the frequency, but I am sure they
>can pass that info on. An excellent article was written about this and
>is listed in the American Competitiveness Institute (ACI) archives
>available online. I purchased these Crest units for two companies I
>used to work for, and I was told that they have been working extremely
>well. It has now been 4 years since I purchased the first unit. What
>did you mean by "US cleaning is a noon for PWAs"?
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
>Sent: Wednesday, August 03, 2005 8:34 AM
>To: [log in to unmask]
>Subject: Re: [TN] Question on cleaning boards with BGA.
>
> Hi Richard:
>
> I have known from different sources including this forum that
>US cleaning is a noon for PWAs. I read an article from China that they
>have developed a US cleaning using a different frequency that does not
>damage components of any kind. It seems that your US cleaner might be
>of the frequency that does not damage components.
>
> Regards,
> Ramon
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard
>Sent: Wednesday, August 03, 2005 8:46 AM
>To: [log in to unmask]
>Subject: Re: [TN] Question on cleaning boards with BGA.
>
>I actually have component application info from at least two BGA
>manufacturers that include US cleaning info, and one (Intel) actually
>recommends cleaning with US and a mix of hot de-ionized water mixed
>with a saponifier. So I question the statement that US causes cracked
>solder joints. I do know that it can damage certain components with a
>resonant cavity.
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
>Sent: Wednesday, August 03, 2005 7:39 AM
>To: [log in to unmask]
>Subject: Re: [TN] Question on cleaning boards with BGA.
>
>Hi Paul! What is the physics behind the ultrasonic cleaning system
>causing cracked BGA solder joints? Is your comment based on published
>data or internal data?
>
>Dave Hillman
>Rockwell Collins
>[log in to unmask]
>
>
>
>
> Paul Edwards
> <paul@SURFACE-ART
> .COM>
>To
> Sent by: TechNet [log in to unmask]
> <[log in to unmask]>
>cc
>
>
>Subject
> 08/02/2005 09:41 Re: [TN] Question on cleaning
> PM boards with BGA.
>
>
> Please respond to
> TechNet E-Mail
> Forum
> <[log in to unmask]>
> ; Please respond
> to
> Paul Edwards
> <paul@SURFACE-ART
> .COM>
>
>
>
>
>
>
>Never use an ultrasonic cleaning system with BGAs unless you want to
>generate cracked solder joints...
>
>Assuming your ECN is at the former label location which is why you need
>complete adhesive removal... find out from your label supplier what
>type of adhesive they are using and have them suggest something...
>
>We use an alcohol/glycol/water mix to remove most label adhesives...
>
>Paul Edwards
>Surface Art Engineering
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of David Harman
>Sent: Tuesday, August 02, 2005 4:58 PM
>To: [log in to unmask]
>Subject: [TN] Question on cleaning boards with BGA.
>
> We are remanufacturing (reworking some of product) due to an ECR
>release. We apply a label with non-conductive adhesive that once
>removed leaves adhesive on the PCBA. This adhesive prevents the board
>from passing due to not making contact. The current process requires
>an operator to use IPA and a soft scrub to remove it. This process is
>time consuming. My CM has suggested that we ultrasonic the boards
>using S-10 solvent.
>
>
>
>My boards have BGAs, interconnect pins, and switches along with the
>normal SMT parts. Will using this s-10 solvent in an ultrasonic
>cleaner work, and will it not cause any reliability issues with BGAs or
>other parts on the boards?
>
>
>
>Anyone have any other suggestions for auto cleaning my boards to remove
>the adhesive. We use the no clean process.
>
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