The temperature target should be between 210 and 225 deg C for
eutectic solder.
        Some soldering systems have nozzles with double walls to direct the
heat from the top to the leads first. Remember to heat the board from the
bottom as well.
        Ramon

> -----Original Message-----
> From: Robert J. Vega [SMTP:[log in to unmask]]
> Sent: Thursday, November 07, 2002 3:01 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] profiling BGAs
>
> How would you recommend placing the thermocouples and creating a profile
> for a ceramic CGA?  I'm farily new at this process, and nobody here has
> ever reworked a CGA.  We've been running into difficulty where the top of
> our package is getting very hot before our solder joints are reaching
> reflow.  Right now we have the tip of our t/c slid between columns and
> placed as close to the solder joints as we could, and then taped in place.
> We're using two t/c, and averaging the values.  Also, we're using a DRS-24
> rework station.  According to what you say below, could we be actually be
> reaching reflow, but because of the way our t/c's are placed, we're not
> registering it?  If so, how could we better place them?  If not, has
> anyone
> else had this problem?
>
> Robert
>
>
>
>
>
>
> Guy Ramsey <[log in to unmask]>@ipc.org> on 11/07/2002 01:30:08 PM
>
> Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please
> respond
>        to Guy Ramsey <[log in to unmask]>
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