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Subject:
From:
Ed Popielarski <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ed Popielarski <[log in to unmask]>
Date:
Wed, 18 Jun 2014 15:09:12 +0000
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Pat,

This is something I had looked into back in the late 80's and at the time was not really viable for FR4 due to terrible fraying of the glass fibers. Perhaps another look is due, since the technology has had a chance to mature, especially with abrasives in the mix (pun intended).

Can you recommend a manufacturer/model, etc.? I'd like to take it for a test drive.

Ed Popielarski
Engineering Manager


                               970 NE 21st Ct.
                              Oak Harbor, Wa. 98277

                              Ph: 360-675-1322
                              Fx: 206-624-0695
                              Cl: 949-581-6601

       “It's one kind of victory to slay a beast, move a mountain, and cross a chasm, but it's another kind altogether to realize that the beast, the mountain, and the chasm were of your own design.”
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Patrick Goodyear
Sent: Tuesday, June 17, 2014 8:10 PM
To: [log in to unmask]
Subject: Re: [TN] Laser depanelization

As long a there is no lead or beryllium to deal with, water jetting is 
the easiest and cleanest.   With or without abrasive.   Cuts above water 
and the board doesn't even get wet, except for maybe some splash back, jet moves way too fast, cutting jet at mach 2 or 3 at 180" per minute linear speed, less than one gal per minute water.  it will leave a clean edge with no burning.

Pat Goodyear
Control Tech Retired
Central Coast Creative Cutting  www.creative-cutting.com


On Tue, Jun 17, 2014 at 4:25 PM, Ahne Oosterhof wrote:

> Hi Ed,
> Try to get a sample done by LPKF.
> 12555 SW Leveton Drive, Tualatin, OR.
> 503-454-4202
>
> Better lasers / much cleaner cut.
>
> Ahne.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Ed Popielarski
> Sent: Tuesday, June 17, 2014 15:42 PM
> To: [log in to unmask]
> Subject: [TN] Laser depanelization
>
> Hi all,
>
> One of our aerospace customers is requesting boards depanelized from 
> support frames.
>
> I looked into router, but the conformal coating tends to smear and 
> will be a significant FOD issue later.
>
> We are willing to invest in laser, however, the result is a bit of 
> charring on the edge, not much of a surprise. Unfortunately, this 
> example http://stevezeva.homestead.com/Capture.JPG was rejected on 
> IPC-A-610-Rev E Para. 10.7.4 "Solder Mask Coating-Discoloration" 
> "Burned or charred solder mask material.
>
> In my opinion, this is not within the "spirit of the law" since there 
> are no specific provisions for laser depanelization, only marking.
>
> Anyone know of some way around this?
>
> Ed Popielarski
> Engineering Manager
>
> [cid:[log in to unmask]]
>                                970 NE 21st Ct.
>                               Oak Harbor, Wa. 98277
>
>                               Ph: 360-675-1322
>                               Fx: 206-624-0695
>                               Cl: 949-581-6601
>
>        "It's one kind of victory to slay a beast, move a mountain, and 
> cross a chasm, but it's another kind altogether to realize that the 
> beast, the mountain, and the chasm were of your own design."
> 
> https://maps.google.com/maps/myplaces?hl=en&ll=48.315753,-122.643578&s
> pn=0.0 11188,0.033023&ctz=420&t=m&z=16&iwloc=A
>
>
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