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| Date: | Fri, 4 Jun 1999 12:21:07 +0900 |
| Content-Type: | text/plain |
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Hi,
BGA is abbreviation of "Ball Grid Array."
It's original meaning is a packaging method. But it also means the substrate
that is used in that package.
Best regards,
Donghun Yoon
-----원본 메시지-----
보낸 사람: Ko Adeline-FSGA2298 <[log in to unmask]>
받는 사람: [log in to unmask] <[log in to unmask]>
날짜: 1999년 6월 4일 금요일 오후 12:06
제목: Re: [TN] stencil thickness
>Hi,
>
>May I know what is BGA?
>
>Thanks & Best Rdgs
>Adeline Ko
>
>> -----Original Message-----
>> From: Feng Yi,BISC PD IE(BJ) [SMTP:[log in to unmask]]
>> Sent: Friday, June 04, 1999 10:49 AM
>> To: [log in to unmask]
>> Subject: [TN] stencil thickness
>>
>> Hi,
>>
>> We will make stencil for module with BGA, Fine pitch(0.4mm) and chip,
>> because we knowed the requirement of stencil thickness it is 0.12mm for
>> fine pitch(0.4mm), but it is 0.2mm for BGA, so we would like to know how
>> thickness is stencil when there are both BGA and fine pitch.
>>
>
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