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Date: | Thu, 19 Aug 2004 07:24:14 -0400 |
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Brightner System (airless, RPP, etc), ASF, Anode Ratio and racking system. Disparties on circuit/panel gemoetry will also create current density differnences from hole center to panel surface.
Jeffrey Bush
Director, Quality Assurance and Technical Support
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302-1890
Tel. 802.257.4571.21 Fax. 802.257.0011
[log in to unmask]
http://www.vtcircuits.com
-----Original Message-----
From: Baski Devre [mailto:[log in to unmask]]
Sent: Thursday, August 19, 2004 1:15 AM
To: [log in to unmask]
Subject: [TN] thickness contol
Dear Technetters,
What are the most effective common factors of the thickness contol at the Double Side, Panel plating, PTH process?
Thanks...
Mustafa YÜCEL
Ürün Kalite Mühendisi
Product Quality Engineer
BASKI DEVRE SAN. ve TIC. LTD. STI.
Ceyhan Sk. No:10 81490 Pendik-Istanbul-Turkey
Tel: 00 90 216 3901036 (4 Hat/Line)
00 90 216 4836560 (4 Hat/Line)
Fax: 00 90 216 3544941
00 90 216 4913269
Internet:www.baskidevre.com.tr
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