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May 2007

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Subject:
From:
Charlie McMahon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Charlie McMahon <[log in to unmask]>
Date:
Thu, 24 May 2007 07:41:30 -0400
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 May I also be included in receiving a copy of this report?
Thank you for your response.

Charlie McManon

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Roberts, Jon
Sent: Thursday, May 24, 2007 7:39 AM
To: [log in to unmask]
Subject: Re: [TN] SV: [TN] SV: [TN] Definition of Eutectic Solder

I also would like to get a copy, if possible,  Thanks, Jon


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Herminia Guevarra
Sent: Thursday, May 24, 2007 6:23 AM
To: [log in to unmask]
Subject: Re: [TN] SV: [TN] SV: [TN] Definition of Eutectic Solder

I'm also anxious to have this report.  Please include me...

Herminia

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Frederick Miller
Sent: Thursday, May 24, 2007 7:55 AM
To: [log in to unmask]
Subject: Re: [TN] SV: [TN] SV: [TN] Definition of Eutectic Solder

Add me to the list.
Fred

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Victor G. Hernandez
Sent: Wednesday, May 23, 2007 4:17 PM
To: [log in to unmask]
Subject: Re: [TN] SV: [TN] SV: [TN] Definition of Eutectic Solder


I would like to view this presentation/report.

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hfjord
Sent: Wednesday, May 23, 2007 3:16 PM
To: [log in to unmask]
Subject: [TN] SV: [TN] SV: [TN] Definition of Eutectic Solder

Richard, George, Werner etc chief gnus,

Want a very advanced article on the theme SAC, IMC, Phosphorous rich Ni,
diffusion rate, solidifying, wetting, ENIG, crystallographic pictures, SEM
pictures, etched cross sections, X-ray investigations, microprobing...more
than 30 pages?

I made a consulting job (metallurgists, need assistance) and had a two hours
presentation of my job. Both companies were satisfied, much thanks to advice
from you, but also thanks to my collegue, who is from Beijing.
He gave me a report that lifted my eyes. I've never seen SAC/ENIG cross
section presentations like that. Not even from China Lake. Can send offline
if you are not too many. Please, be aware this is not a popularised kind of
presentation, but at a advanced metallographic level. You may have it
already...don't know, but the report is fresh.

Inge

-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För Werner Engelmaier
Skickat: den 23 maj 2007 20:44
Till: [log in to unmask]
Ämne: Re: [TN] SV: [TN] Definition of Eutectic Solder

Hi Richard,
If you try to solder at or just above the Solidus temperature, you need a
long time to get wetting [it takes thermal energy to dissolve the base metal
into Sn], and you may not get good wetting art all. That is why I recommend 
Liquidus+20C for reflow soldering to Cu, and Liquidus+35C for reflow
soldering to
Ni. This time above 183 recommendation of 60 to 90 sec is wrong.



Werner



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