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July 1998

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Subject:
Underfill epoxy for flip chip -Reply
From:
"Fanny TANG (ASD)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 21 Jul 1998 12:20:15 +0800
Content-Type:
text/plain
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text/plain (20 lines) 
Alpha Metals EL-18UF. It is low viscosity epoxy encapsulant specially
designed for flip chips with very fine fillers.

Hope this help !!

Fanny Tang
Hong Kong Productivity Council

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