Hi Franklin,
Osterman at CALCE made a calculation job for a MIL vendor 1999. I don't have
his whole report on 98 pages, but a short version. Barrel life vs temp
changes is one of many parameters. I'll send it offline. Osterman's adress
is in the report.
/Inge




-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För Werner Engelmaier /*
Skickat: den 19 mars 2008 03:45
Till: [log in to unmask]
Ämne: Re: [TN] How much stress is needed?

Hi Franklin,
You describe a classic via barrel crack—comes from the thermal expansion 
mismatch between the ED copper and the PCB resin in the z-direction during
the 
soldering processes [the hotter the worse—read lead-free] [you should be
taking 
my workshop on the subject at IPC EXPO/APEX on the morniong of March 31.

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com



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