TECHNET Archives

April 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
assembly
From:
"Vertefeuille, Russ (AZ77)" <[log in to unmask]>
Date:
10 Apr 1997 16:07:00 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (25 lines) 
Hello Technet,
Is anyone out there experiencing solderability problems (dewetting) on QFP 
fine pitch devices that are Palladium plated or coated over nickel (copper 
lead frames)?  The parts in question are 4 - 6 months old. Storage is open; 
Parts are baked at 125C for 24 hours prior to placement. Paste used is RMA 
390 DH3. Reflow is forced convection (BTU  VP98).
Any help on this issue would be greatly appreciated!!

Russ Vertefeuille
Mfg. Eng.
Honeywell


***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************

ATOM RSS1 RSS2