Hello,
    When floating coupons (for eventual crossectioning) on solder multiple times
(with a cool-down to ambient in between), to see if defects appear, should the
sample be turned over for each new float?  Is there a procedure or paper that
addresses this question? If anyone is doing this , what is the reason?
Thanks
Rich

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     Richard Olsen                Telephone (602)-824-8599
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     USA                    I make circuit boards,what do you do?
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