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> -----Original Message-----
> From: Jack Crawford [SMTP:[log in to unmask]]
> Sent: Monday, June 14, 1999 11:01 AM
> To: [log in to unmask]
> Subject: Re: [TN] BGA reliability testing
>
> IPC-7095 is at the PROPOSAL stage and can be received by anyone who can
> receive
> e-mail message attachments.
>
> Just send an e-mail message to: techdoc
> And the SUBJECT line must be exactly these characters/spacing: request
> IPC-7095
> The body should have just your name, company and contact phone number in
> case there
> is a problem with the e-mail and we need to contact you.
>
> jack
>
> ==========================================
> APEX - the industry's premier trade show in Electronics
> Manufacturing, March 12-16, 2000, Long Beach, California.
> More information on website www.ipc.org/html/apex.htm
> -----------
> Jack Crawford, IPC Director of Assembly Standards and Technology
> 2215 Sanders Road, Northbrook IL 60062-6135
> [log in to unmask]
> 847-790-5393
> fax 847-509-9798
>
> >>> "McMonagle, Michael R." <[log in to unmask]> 06/12/99 07:44AM >>>
> Jason,
> The current working draft of IPC-7095, Design and Assembly
> Process Implementation for BGAs, speaks to this issue in Section 6.4
> (Impact of Wave Solder on Top Side BGAs) along with ways to validate and
> correct if required. This is an extremely solid reference on BGAs, its
> ultimate release will be of great help to those just beginning to
> venture into BGAs. As the file is a little big for TechNet (don't want
> to tick off Hugo, hehehe), I'll send it to you direct under separate
> EMail. Remember that draft standards are usually available from IPC for
> review and comment on a variety of topics, but any pass/fail criteria
> should not be used as an absolute based on a draft revision.
>
> Mike McMonagle
> PCA Process Engineering Supervisor
> K*Tec Electronics
> 1111 Gillingham Lane
> Sugar Land, TX 77478
> (281) 243-5639 Phone
> (281) 243-5539 Fax
> [log in to unmask]
>
> > -----Original Message-----
> > From: Jason Smith [SMTP:[log in to unmask]]
> > Sent: Friday, June 11, 1999 2:45 PM
> > To: [log in to unmask]
> > Subject: Re: [TN] BGA reliability testing
> >
> > What does the industy do for qualifications and reliability for BGAs?
> > What
> > testing is generally done. I'm trying to see if a BGA connection is
> > affected in
> > any way by going through the wave solder for qualifying that in our
> > process.
> > Any insight would be helpful.
> >
> > Jason
> >
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> Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
> section for additional information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or
> 847-509-9700 ext.312
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TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
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To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
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TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
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To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
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