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November 2003

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Subject:
Dimples in plated Copper
From:
Nishath Yasmeen <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Wed, 5 Nov 2003 10:09:10 -0600
Content-Type:
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text/plain (24 lines) 
Hello TechNetters,
    We plate Copper onto wafers and I have been facing depressions or
dimples as we call them. This started last week post a DI water shutdown we
had on-site.
     We recovered on most of the plating hoods but one has been very
stubborn. I know dimples are caused by air bubbles sticking to the surface.
This does not allow the plating process to start in time. We have tried to
look for air bubbles but have not been successful. Are there any other
sources for this defect?
     Any/all input from you is greatly appreciated.

Thanks!
Yasmeen

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