You probably noticed this already; but when you are in El Paso, you are
closer to LA than you are to Louisanna. Hope you have a safe drive.
Happy holidays to you and your family,
Kim Haynes
Interface and Clock Products
High-Speed Serial Link Applications
Texas Instruments, Inc.
214-567-2057 Telephone
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Friday, December 14, 2007 2:29 AM
To: [log in to unmask]
Subject: Re: [TN] "Grape-ing" update 1
I have seen this on a number of occasions and would offer the following
advice:
In this (somewhat unfortunate) condition, the solder spheres are at some
point getting hot enough to reflow but at this point you are just about
out of flux activity due to the activity having been virtually "baked
out"
during the ramp.
Corrective actions are to get to reflow temp faster and make sure that
the temperature is adequate to actually get the joints into reflow.
This condition is actually more predominant on small components where
the amount of solder (and hence flux to break down oxides) is somewhat
limited - you will see it first on components such as 0201's.
Sorry if this data has been already supplied - I am on a road trip
bringing my Daughter back from college - have stopped at a motel - just
drove the width of Texas - wow that is one large State........
Back in CA sometime very late tonight.
John Burke
(408) 515 4992
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Phillip Bavaro
Sent: Thursday, December 13, 2007 3:44 PM
To: [log in to unmask]
Subject: Re: [TN] "Grape-ing" update 1
This month started with concerns about passives not having bright silver
shiny solder connections (and we all know that is a thing of the past),
and now we have grapes.
We don't have any failures at all related to either of these two
cosmetic issues, and there are a myriad of surface finishes involved
altogether.
My response, so far, has been to stick to IPC terms and
definitions........and from what I have seen so far, the connections
exhibit acceptable wetting so this is purely a cosmetic issue for now.
The root cause, according to some sources is supposed to have to do with
exhaustion of the flux vehicle during reflow...but that is contradictory
to the second theory offered that the time at reflow was not long enough
to allow proper melting.
I will keep you posted as I "learn" more. BTW, it is Friday in China.
At 01:22 PM 12/13/2007 -0800, Miguel Vallejo wrote:
>Poor wetting seems to fit the bill, why call it something else..?
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Dale Ritzen
>Sent: Thursday, December 13, 2007 11:56 AM
>To: [log in to unmask]
>Subject: Re: [TN] "Grape-ing"
>
>See attached CircuitNet answer (Ask the Experts) by Neil Poole for
>definition (beings as it's not Friday yet)...
>
>http://www.circuitnet.com/articles/article_40078.shtml
>
>Dale Ritzen
>Quality Manager
>Austin Manufacturing Services
>
>-----Original Message-----
>From: Stadem, Richard D. [mailto:[log in to unmask]]
>Sent: Thursday, December 13, 2007 1:05 PM
>To: [log in to unmask]
>Subject: Re: [TN] "Grape-ing"
>
>
>Never heard of it. If your paste supplier is educating you, shouldn't
>you be enlightening us?
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Phillip Bavaro
>Sent: Thursday, December 13, 2007 5:06 AM
>To: [log in to unmask]
>Subject: [TN] "Grape-ing"
>
>My solderpaste supplier is educating me regarding a defect called
>"grape-ing".
>
>Anyone care to shed a little light on this soldering defect?
>
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