There was an article in PCD November 1998 by James Blankenhorn, president of
SMT Plus, Inc. in Scotts Valley California Entitled "Increasing Density by
placing Vias in Lands" that talked about via in pad technology... perhaps
that will help.

Bill Brooks
PCB Design Engineer , C.I.D.
TITAN SYSTEMS CORPORATION
DATRON WORLD COMMUNICATIONS DIVISION
3030 Enterprise Court
Vista, CA 92083
Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510
mailto:[log in to unmask]
IPC Designers Council, San Diego Chapter
<http://www.ipc.org/SanDiego/>
<http://home.fda.net/bbrooks/pca/pca.htm
http://dc.ipc.org/


-----Original Message-----
From: Ken Patel [mailto:[log in to unmask]]
Sent: Monday, March 04, 2002 2:37 PM
To: [log in to unmask]
Subject: [TN] Via in Pad? Need Help!!!
Importance: High


Guys,
On our nickel gold board, solder joints are below IPC spec (insufficient
solder) where there are vias in pad. Solder is drained down the via
holes and deprived the joint of necessary solder.  I would like to know
the following.
(1) How about using the surface finish 63/37 coating HASL instead of
Ni-Gold? I think gold dissolves in solder so quickly that I rather use
HASL processed boards, any thoughts?
(2) Do you guys mask the via on bottom side to avoid solder draining out
on the other side?
(3) Does anybody try Hi Temp solder paste to fill the vias as our
assembly house ordered via stencils to fill the via using eutectic
(63/37) solder paste which didn't work?

Looking for
re,
Ken Patel

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