To all the metallurgy-minded readers.

The old standard for Sn60Pb40 and similar solder baths (J-STD-001?) gave 
max Nickel as 0.01%, but I have failed to find any definitive evidence of the 
negative effect on solder joints that leads to this figure. An older reference 
said that upto 0.1% was OK and gave various possible problems it might cause 
but claimed most of these were based on disputed evidence.

Apparently for SAC305 and similar SAC alloys, J-STD-006 also specs the same 
0.01% max level of Nickel, but again I don't know what detrimental effect this 
would have, given one popular SnCu alternate alloy actually includes about 
0.05% Nickel as a deliberate and beneficial additive.

Its apparent that the high tin content lead-free alloys are quite good at pulling 
some nickel content out of stainless steel, even when components in contact 
with the moving molten metal are treated to increase resistance to erosion.

Can anyone enlighten me further?

Thanks

Nigel

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------