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| Reply To: | TechNet E-Mail Forum. |
| Date: | Wed, 13 May 1998 15:58:19 -0400 |
| Content-Type: | text/plain |
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Yikees! Electroless Ni/ immersion gold is not compatible with soldered
BGA's? We need more than luck!
The only Proceedings listing I see on the IPC web page and in their
Publications 98 is was released in June 97. Do you have a document
number or other source for these 'allegations'?
Cheers,
Greg
-----Original Message-----
From: Josh Moody [SMTP:[log in to unmask]]
Sent: Wednesday, May 13, 1998 3:34 PM
To: [log in to unmask]
Subject: Re: [TN] Reliability of Immersion Gold PCB
If you would like a paper look into the proceedings
that occurred last Sept at IPC Surface Finish Summit in St.
Paul,MN.
There was a paper presented there that discusses the issues
behind electroless Ni/ immersion gold and why it is not
compatible
with soldered BGA's.
Good luck,
At 01:30 PM 5/13/98 -0400, you wrote:
>Hi Steve, thank you for your comment! What I really want to
know is the
>reliability of the product by using immersion gold PCB,
including solder
>joint reliablity and integrity of the PCB after process. Do you
know whether
>IPC has any standard or publication on this topic? Is it
Bellcore compliant?
>What is the issue with BGA for immersion gold?
>
>Thanks again!
>
>Fulton Feng
>
>> ----------
>> From:
>>
"STEVE_O\\'HARA"@HP-Vancouver-om10.om.hp.com[SMTP:"STEVE_O\\'HARA"@HP-Va
nc
>> ouver-om10.om.hp.com]
>> Sent: Wednesday, May 13, 1998 10:01 AM
>> To: Feng, Fulton [MPK:5221:EXCH]
>> Cc: [log in to unmask]
>> Subject: Re: [TN] Reliability of Immersion Gold PCB
>>
>> What do you want to know??
>>
>> Raw Board Reliability (solderability)
>> Contact Resistance Reliability?
>> Solder Joint Reliability
>>
>> With regards to Solder Joint Reliability, the solder
interface of the
>>
>> nickel to solder forms tin intermetallics which will not
be as strong
>>
>> as solder to solder. These joints will still be
acceptable for most
>> smt components but immersion gold and BGA's should be
avoided.
>>
>> Regards:
>>
>> Steve O'Hara HP
>>
>>
>> ______________________________ Reply Separator
>> _________________________________
>> Subject: [TN] Reliability of Immersion Gold PCB
>> Author: Non-HP-Fulton.Feng.ffeng ([log in to unmask])
at
>> HP-Vancouver,mimegw10
>> Date: 5/12/98 5:39 PM
>>
>>
>> Hi
>> Has anyboy done any reliability study on Gold Immersion PCB
finish?
>>
>> Thanks
>> Fulton Feng
>>
>>
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>
Josh Moody
Materials Quality Engineer
Hewlett-Packard - Richardson (HPSD)
ph# (972) 497-4617
[log in to unmask]
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