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January 2002

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Subject:
From:
Earl Moon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 16 Jan 2002 06:14:47 -0600
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Polyimide boards, as an example, are more hygroscopic than most other
board/material types at about .5% whereas epoxies are about half that. I
believe better specs are available than your shop's recommendations. Boiling
just doesn't get it for me. Also, supplier dessication is a good idea as
well as pre-baking at your site, if the supplier doesn't, then sealing and
dessicating until use. Upon climb out, cruise at altitude, and descent, the
boards will be tested severely enough without time for baking - unless in
Afghanastan in the summer months.

MoonMan

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