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Subject:
From:
Grossmann, Günter <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Grossmann, Günter <[log in to unmask]>
Date:
Tue, 28 Jan 2020 08:33:02 +0000
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Steve

Yes it is needed.
Nickel between the gold and the copper has nothing to do with mechanical strength it is a diffusion barrier. If you plate gold directly on copper the gold would diffuse rapidly into the copper (A.B. Martin et al., Journal of Applied Physics, Vol 25, Number 3, March 1954), even at ambient temperature, and the resulting surface would not be solderable.


Best regards

Günter 


-----Ursprüngliche Nachricht-----
Von: TechNet <[log in to unmask]> Im Auftrag von Steve Smith
Gesendet: Montag, 27. Januar 2020 23:32
An: [log in to unmask]
Betreff: [TN] Is Nickel really needed under the gold plating on copper?

Hi All,

I was asked today if nickel is really needed under the gold for plating on copper. I have understood it that the layer of nickel provides a mechanical backing for the gold layer and that it was also needed for the soldering process. Is this correct and is it the only reason it is used?


My regards,

Steve Smith
Design Drafting Group Manager
Staco Energy Products

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