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September 2011

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Subject:
From:
Carl VanWormer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Carl VanWormer <[log in to unmask]>
Date:
Tue, 20 Sep 2011 09:35:52 -0700
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I didn't mean that I could peel the solder off the leads, but that I could shave it off with my knife blade, indicating that all the solder went with the component and none was left on the PC board pads.

Later,
Carl


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Pete
Sent: Tuesday, September 20, 2011 9:23 AM
To: [log in to unmask]
Subject: Re: [TN] large parts falling off finished surface mount board assemblies

Interesting that you could also peel the solder off the leads.  Adds to the reflow process failure idea.

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