Who makes the two packages and how old are they? Some time ago, many had a 
problem with the mold epoxy, namely too much red phosphorous. Millions of IC 
packages were infected and died after some time. I have been involved in 
that circus and am fed up with the whole story, so I make it easy for myself 
by giving you the below article to read yourself.

To decide if you have this issue, you need contact a skilled analysis lab 
with  people who are familiar with the methods to reveal red phosphorous . 
Bev ought to know.

/Inge

http://www.theriac.org/DeskReference/viewDocument.php?id=9&Scope=journal&year=2006&Q=3

----- Original Message ----- 
From: "Toby Carrier" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, July 17, 2009 7:51 PM
Subject: [TN] ESD failure difference between 16-QSOP and 16-SOIC Video 
Buffer


Hi,

Does anyone have an idea why a 16-SOIC Video buffer would pass ESD
testing with being kludged in, compared to a 16-QSOP package of the same
part actually soldered to the PCB? The SOIC part passes a Chassis and
Common ground Air Gap event up to 25kV, but the QSOP part has failures on
both chassis and common at 1kV and less? I would appreciate any articles or
explanations that you might have.

Thanks

Toby Carrier
Engineering Technician

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