Good Day Technet!  Happy Friday.

My question today: we use an underfill on some BGAs, Loctite 3568.
This is allegedly reworkable, but until today we have not had to verify
that claim.  On some test boards we can get the part off OK, the problem
is how to get the underfill material off of the PWB so that we can place
a new component.  We are not finding it to be easy.

Anyone have any tips on removing "reworkable" underfill materials from
a PWB, in particular Loctite 3568?

Thanks!


regards,

Graham Collins
Process Engineer,
L-3 Communications Electronic Systems Inc.
Halifax
(902) 873-2000 ext 6215

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