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March 2014

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Wed, 12 Mar 2014 17:35:32 +0000
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You mean something like this? 

Block Random Access Memory (BRAM) is a dedicated 18K/36Kbits hard logic configurable memory module embedded in Field Programmable Gate Array (FPGA) devices. BRAMs can be inferred as First In, First Out (FIFO) buffers, single or dual port, and cascading memory blocks accessed via by-1, 2, 4, 9,18, and 36 modes. Physical failure analysis (PFA) of intermittent read and write failures evident only at fast frequency mode due to void-like metal defect in 36K(36,864 bits) BRAM block is very difficult and complex. Conventional PFA techniques such as OBIRCH and photon emission analysis cannot be used to localize the failure because of frequency dependency and intermittency of failure. Nano-probing each metal trace is almost impossible for an extremely wide area of memory array. This paper will discuss the fast-frequency, initialized read-only diagnostic and failing signature commonality analysis technique and how it was utilized to quantify and localize the defect of an intermittent BRAM failure. A metal-void defect was found as an evidence of this intermittent failure electrically fault isolated by the technique described in this paper.


Published in:
 Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the 
Date of Conference:
 15-19 July 2013 
Page(s): 526 - 530

Joyce Koo
Researcher
Materials Interconnect Lab
Office: (519) 888-7465 79945
BlackBerry: (226) 220-4760


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Markel
Sent: Wednesday, March 12, 2014 1:14 PM
To: [log in to unmask]
Subject: [TN] NFF...any new developments ?

I have been in this industry (assembly, contract assembly, etc...) for a bunch of years and there seems to be no big leaps and bounds into eliminating or at least isolating NFFs (those infamous intermittent issues for the most part) and taking steps to eliminating them (whatever the source of the failure mode is, whether OEM, design, assembly process (eg - ESD))....

So the big question - does anyone here know of an in-depth study into NFFs/Intermittents since a quick search of the archives here (yes, I am a new subscriber) did not give me too much insight, except for the connector issue/film build-up.


Thanks and have a good one,
Dave.

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