I have a surface mount connector which comes from the manufacturer with a pure
tin coat. There seems to be some concern from the design facility about the
possibility of dendritic growth because of the tin.  Is there any reason that we
can't just tin this part in our normal tinning operation Sn63/Pb37 500degC. to
prevent their concern?  We ( manufacturing people ) were not told about the tin
coating until we had already built some of these boards. So the first lot did
not have the parts tinned as they were within our age requirements. So much for
comunication.

Thanks in advance for any help.
Charles Caswell
Process Lead, PCB
Frontier Electronic Systems

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