Grant,

If you run an assembly on your ICT directly after any process requiring heat, you will
see a bunch of false failures.  The assemblies do require time to allow the components
to normalize prior to testing.

Gary Camac

Grant Emandien wrote:

> Hi all out there,
>
> What is the average period for a solder joint (reflow and wave) to 'cure'? I
> also state that I don't quite know what cure means in this instant - but the
> general problem we have is the minimum period (if there is such a thing!)
> required for a solder joint to cure before introducing it to ICT under
> reasonable conditions of stability.
>
> Our test guys are complaining that the assemblies reach there machines too
> late (hours later), resulting in hardened flux which the test pins have
> difficulty in penetrating, causing damaged pins, retesting and hence
> unnecessary wear of the test fixtures and reduction in throughput.
> Introducing the assemblies too early while the joints are still in
> 'transition' may also result in retesting (true or false?).
>
> As you may have guessed, we don't clean boards as a norm however, this may
> be the way to go in future as will be experimenting with a cleaner shortly.
>
> Cheers
> Grant
>
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