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October 1999

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Subject:
Re: TIN/GOLD alloy
From:
Jack Crawford <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sun, 17 Oct 1999 16:40:28 -0500
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Gaby, et al

Don't forget that IPC also has a leadfree website http://www.leadfree.org and we are
hosting a leadfree e-mail forum (like technet) also.  More info on that website.
jack

>>> Gabriela Bogdan <[log in to unmask]> 10/17/99 03:00PM >>>
Dear TechNetters!
Please could you comment on the use of Tin/Gold 90/10 solder ?
The application is for microwave applications when soldering to gold.
Its melting temp. is 217C .
I have the following questions:
How does this composition correlate with the maximum gold content in a
solder joint?
Would it be possible to pass such a subassembly through a secondary
reflow with 63/37 Tin/Lead?
Is it recommended ONLY for soldering to gold?
It must be very expensive too??!!
Paul, Werner, my apologies.
Thank you
Gaby

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