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October 1999

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Subject:
From:
Graham Naisbitt <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 5 Oct 1999 22:29:21 +0100
Content-Type:
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Wilber,

It is my guess that the OA material you are using is water washable NOT
water SOLUBLE.

Semantics? Maybe, but water washable materials contain some rosin that
usually (in my experience) results in foaming.

Check with you material vendor if the product is rosin free and completely
water soluble.

If you have OA residues after reflow, dont bother the test lab - you have a
problem. These are designed to be aggressive and effective at removing
oxides, so MUST be washed off. - Now you must re-visit your cleaner
spec........

Hope this helps.

Regards,
Graham Naisbitt

[log in to unmask]

WEB: http://www.concoat.co.uk

CONCOAT Ltd
Alasan House, Albany Park
CAMBERLEY GU15 2PL UK

Tel: +44 (0) 1276 691100  Fax: +44 (0) 1276 691227
----- Original Message -----
From: Wilber E Heath <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, October 04, 1999 2:10 PM
Subject: [TN] Test Labs


> I am looking for a test lab in the New England area that can test for
residue
> left on a PCB after completing reflow. We have some of our product that
causes
> excessive foaming in our aqueous cleaner, and it appears to be excess
solder
> paste. Need to have these particular boards evaluated to determine if
there
> actually is excess paste or some other deposit causing this foam problem.
>
> Please reply to [log in to unmask]
>
> Thanks
>
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