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July 2008

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Subject:
From:
Brian Chandler <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Brian Chandler <[log in to unmask]>
Date:
Thu, 17 Jul 2008 06:47:44 -0500
Content-Type:
text/plain
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text/plain (21 lines)
We use the compliant pin process with an OSP over bare copper board finish
in automotive applications. We have not experienced any failures during our
reliability testing. Our tests include -50C to +150C thermal shock 1000
cycles, high temp  storage +145C for 250 hours, and temp/humidity +85C @ 85%
RH for 500 hours.

We did experience failures on the NiAu board finish for retention force and
contact resistance. These failure occurred in the thermal shock testing. 

Regards,

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