Marsal,
Check:
1) The type of solder mask you have - is it "good" for midchip solder
balls (squeeze balls, solder beads)?
2) Pressure of part placement
3) Solder pad placement on the board and size, especially with respect
to the size of the particular chip causing problems.

I am sure others will mention more.
Bev
RIM

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Marsal Tampubolon
Sent: Tuesday, February 27, 2007 4:59 AM
To: [log in to unmask]
Subject: [TN] Solder Ball Stick beneath of the chip resistor/ capacitor.

Dear   Tech  Netter..
Any one   in  forum  ever  facing  solder    ball   beneath   of  the
chip 
 cap  and  chip  resistor  ?  FYI  our  stencil  thickness  is  7  Mils 
and  majority  happen  on  1206  part   size.  Also   the   raw  PCB
it 
self  have  mask  with  thickness   around  1  Mils  which   defenetely 
increase  the   solder   paste  thickness  after  printing.   Any  thing

we  can  do  with  decrease  stencil   thickness  or   stencil  opening
to 
 resolve  this   issue  ?
Highly  appreciate   your   advice .

****************************************************
Regards... 
Marsal GM Tampubolon.
Senior   Quality   Engineer
CEI  Contract  Manufacturing, Singapore.
Batam  Plant,  Indonesia.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------



---------------------------------------------------------------------
This transmission (including any attachments) may contain confidential information, privileged material (including material protected by the solicitor-client or other applicable privileges), or constitute non-public information. Any use of this information by anyone other than the intended recipient is prohibited. If you have received this transmission in error, please immediately reply to the sender and delete this information from your system. Use, dissemination, distribution, or reproduction of this transmission by unintended recipients is not authorized and may be unlawful.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------